The position
Mobileye develops high-performance imaging radar for autonomously driving vehicles. The project involves cutting-edge HW, VLSI, mechanics, SW and Algorithms. We are looking for an
Experienced Chip Package Design Engineer
to be part of our imaging radar HW team.
What will your job look like:
Technical Project lead & Co Design to support the development of IC package with the OSAT, Si, VLSI and System Architecture teams.
Manage subcontractors and vendors for development and manufacturing of chip substrate, IC package and IC testing
Design and hands-on one of the chip package layout, simulate high-performance signal/power-integrity chip substrate, including layout, mechanical & thermal simulations
Collaborate and support peer teams from other projects
All you need is:
B.Sc in Electronic or Mechanical Engineering
3+ years of hands-on experience as managing chip packaging vendors
5+ years of hands-on experiences in chip package activities
Experience with relevant CAD tooling for chip package development & simulation for layout, mechanical & thermal simulations
Experience with Digital High Speed, Analog and Power design
Experience with Signal Integrity and Power Integrity simulation tools for Digital and analog using IBIS and S-Parameters models – advantage
Familiar with Automotive industry– advantage
Experience with RFIC design and simulation – advantage
Mobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles. If you are an excellent, bright, hands-on person with a passion to make a difference come to lead the revolution!
