The position
EPG Platform Group is responsible for developing Mobileye’s SoC package, SoC Evaluation Systems and various Automated Driving Platforms.
We are looking for a
Senior PCB Design Layout Engineer
to be a key player in the development of the next-generation platforms
What will your job look like?
Working closely with Hardware, Mechanical and SI/PI engineers, you'll perform PCB layout of the most advanced Mobileye' platforms.
Complete development of CAD layout from footprint definition, detailed component placement and constraints management.
Be responsible for the design releases required generation of artwork files, ODB++, FAB drawings, ICT report, and electronic PCB documentation.
Your designs will need to follow IPC class 3 , signal and power integrity constraints, EMI/RFI control and automotive regulations.
The work includes collaboration with various teams, from different relevant disciplines.
All you need is:
B.Sc in Electronic Engineering or equivalent experience;
5+ years experience in high-speed design a must.
Having a detailed knowledge o f circuit design and consideration for layout, routing, and timing constraints;
Be an authority in using PCB design tools (Cadence Allegro – preferrable).
Knowledge in PCB manufacturing processes for HDI, Standard Thru-Hole, and Back-drilling.
A background in understanding of PCB Signal Integrity and Power integrity – an advantage.
Handling DFM, DFA, DFT constraints in volume manufacturing – an advantage.
Strong verbal and written communication skills in English.
*At Mobileye, employees work four days a week. For this position, two days are at the Jerusalem site, and the other two can be from a central Israel site (Tel Aviv or Petah Tikva).
Mobileye changes the way we drive, from preventing accidents to semi and fully autonomous vehicles. If you are an excellent, bright, hands-on person with a passion to make a difference come to lead the revolution!
